Inventor
MORET ERIC J M
US11 patents
⚠️ This page may combine multiple inventors who share the name “MORET ERIC J M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
10 patentsUS12506083B2Dec 23, 2025
Liquid metal interconnect for modular package server architecture
INTEL CORP0 citations60
US12411296B2Sep 9, 2025
Reworkable zero-force insertion electrical optical package socket and method
INTEL CORP0 citations59
US12253901B2Mar 18, 2025
Systems and methods for stable and elevated idle-mode temperature for assembled semiconductor devices
INTEL CORP0 citations54
US12519049B2Jan 6, 2026
Liquid metal interconnect for modular system on an interconnect server architecture
INTEL CORP0 citations50
US12494435B2Dec 9, 2025
Liquid metal interconnect for modular system on an interposer server architecture
INTEL CORP0 citations50
US7960190B2Jun 14, 2011
Temporary package for at-speed functional test of semiconductor chip
INTEL CORP1 citations50
US12591096B2Mar 31, 2026
Technologies for a beam expansion and collimation for photonic integrated circuits
INTEL CORP0 citations49
US12345931B2Jul 1, 2025
Optical circuit with optical port in sidewall
INTEL CORP0 citations49
US10120018B2Nov 6, 2018
Adaptive thermal actuator array for wafer-level applications
INTEL CORP0 citations48
US9835679B1Dec 5, 2017
Systems, methods, and apparatuses for implementing fast throughput die handling for synchronous multi-die testing
INTEL CORP1 citations48