Inventor

JAO RAYMOND

TW2 patents

⚠️ This page may combine multiple inventors who share the name “JAO RAYMOND”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SILICONWARE PRECISION IND CO L

1 patent

US6114752ASep 5, 2000

Semiconductor package having lead frame with an exposed base pad

SILICONWARE PRECISION IND CO L115 citations94

SILICONWARE PRECISION INDUSTRIES CO LTD

1 patent

US6555296B2Apr 29, 2003

Fine pitch wafer bumping process

SILICONWARE PRECISION INDUSTRIES CO LTD44 citations90