Inventor
FAN FENG-HSU
TW29 patents
⚠️ This page may combine multiple inventors who share the name “FAN FENG-HSU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEMILEDS OPTOELECTRONICS CO
10 patentsUS8871547B2Oct 28, 2014
Method for fabricating vertical light emitting diode (VLED) structure using a laser pulse to remove a carrier substrate
SEMILEDS OPTOELECTRONICS CO23 citations92
US7897420B2Mar 1, 2011
Light emitting diodes (LEDs) with improved light extraction by roughening
SEMILEDS OPTOELECTRONICS CO35 citations92
US8003994B2Aug 23, 2011
Vertical LED with current guiding structure
SEMILEDS OPTOELECTRONICS CO10 citations84
US7968379B2Jun 28, 2011
Method of separating semiconductor dies
SEMILEDS OPTOELECTRONICS CO5 citations73
US8921204B2Dec 30, 2014
Method for fabricating semiconductor dice by separating a substrate from semiconductor structures using multiple laser pulses
SEMILEDS OPTOELECTRONICS CO4 citations70
US8716041B2May 6, 2014
Method for fabricating side by side light emitting diode (LED) having separate electrical and heat transfer paths
SEMILEDS OPTOELECTRONICS CO2 citations62
US8723160B2May 13, 2014
Light emitting diode (LED) die having peripheral electrode frame and method of fabrication
SEMILEDS OPTOELECTRONICS CO1 citations52
US8703515B2Apr 22, 2014
Method for guiding current in a light emitting diode (LED) device
SEMILEDS OPTOELECTRONICS CO1 citations52
US7892891B2Feb 22, 2011
Die separation
SEMILEDS OPTOELECTRONICS CO0 citations52
US9130114B2Sep 8, 2015
Vertical light emitting diode (VLED) dice having confinement layers with roughened surfaces and methods of fabrication
SEMILEDS OPTOELECTRONICS CO0 citations47
CHU CHEN-FU
6 patentsUS8685764B2Apr 1, 2014
Method to make low resistance contact
CHU CHEN-FU24 citations92
US8507302B1Aug 13, 2013
Wall structures for a semiconductor wafer
CHU CHEN-FU11 citations92
US8124454B1Feb 28, 2012
Die separation
CHU CHEN-FU6 citations84
US8283652B2Oct 9, 2012
Vertical light emitting diode (VLED) die having electrode frame and method of fabrication
CHU CHEN-FU2 citations63
US8466479B2Jun 18, 2013
Light emitting diodes (LEDs) with improved light extraction by roughening
CHU CHEN-FU0 citations52
US8802469B2Aug 12, 2014
Method of fabricating semiconductor die using handling layer
CHU CHEN-FU1 citations51
SEMILEDS OPTOELECTRONICS CO LT
4 patentsUS7723718B1May 25, 2010
Epitaxial structure for metal devices
SEMILEDS OPTOELECTRONICS CO LT29 citations96
US7759670B2Jul 20, 2010
Vertical LED with current guiding structure
SEMILEDS OPTOELECTRONICS CO LT24 citations92
US7687322B1Mar 30, 2010
Method for removing semiconductor street material
SEMILEDS OPTOELECTRONICS CO LT22 citations92
US7563625B2Jul 21, 2009
Method of making light-emitting diodes (LEDs) with improved light extraction by roughening
SEMILEDS OPTOELECTRONICS CO LT36 citations92
LIU WEN-HUANG
3 patentsUS8546818B2Oct 1, 2013
Vertical LED with current-guiding structure
LIU WEN-HUANG3 citations62
US8648370B2Feb 11, 2014
Wafer-type light emitting device having precisely coated wavelength-converting layer
LIU WEN-HUANG3 citations60
US8148733B2Apr 3, 2012
Vertical LED with current guiding structure
LIU WEN-HUANG1 citations51