Inventor
DOAN DAVID TRUNG
TW15 patents
⚠️ This page may combine multiple inventors who share the name “DOAN DAVID TRUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SEMILEDS OPTOELECTRONICS CO
9 patentsUS11817536B2Nov 14, 2023
Method for making electronic device arrays using a temporary substrate and a carrier substrate
SEMILEDS OPTOELECTRONICS CO4 citations85
US10910535B2Feb 2, 2021
Method for making light emitting device LED arrays
SEMILEDS OPTOELECTRONICS CO4 citations83
US11728461B2Aug 15, 2023
Single light emitting diode (LED) structure having epitaxial structure separated into light emitting zones
SEMILEDS OPTOELECTRONICS CO2 citations72
US11387397B2Jul 12, 2022
Method for making light emitting device (LED) arrays using a temporary substrate and a carrier substrate
SEMILEDS OPTOELECTRONICS CO3 citations72
US10964851B2Mar 30, 2021
Single light emitting diode (LED) structure
SEMILEDS OPTOELECTRONICS CO2 citations72
US12206051B2Jan 21, 2025
Light emitting diode (LED) structure having single epitaxial structure separated into light emitting zones
SEMILEDS OPTOELECTRONICS CO0 citations62
US12191434B2Jan 7, 2025
Method for making electronic device arrays using a temporary substrate
SEMILEDS OPTOELECTRONICS CO0 citations62
US12364079B2Jul 15, 2025
Method for making light emitting device (LED) arrays and electronic products using a temporary substrate and a carrier substrate
SEMILEDS OPTOELECTRONICS CO0 citations51
US9130114B2Sep 8, 2015
Vertical light emitting diode (VLED) dice having confinement layers with roughened surfaces and methods of fabrication
SEMILEDS OPTOELECTRONICS CO0 citations47
SEMILEDS CORP
5 patentsUS11417799B2Aug 16, 2022
Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plate
SEMILEDS CORP4 citations82
US12002792B2Jun 4, 2024
Method and system for transferring alignment marks between substrate systems
SEMILEDS CORP0 citations62
US11545474B2Jan 3, 2023
Method and system for transferring alignment marks between substrate systems
SEMILEDS CORP1 citations62
US11862755B2Jan 2, 2024
Method for fabricating (LED) dice using laser lift-off from a substrate to a receiving plate
SEMILEDS CORP0 citations61
US11862754B2Jan 2, 2024
Method for fabricating (LED) dice using semiconductor structures on a substrate and laser lift-off to a receiving plate
SEMILEDS CORP0 citations61