Inventor · disambiguated record
Ronald J. Jensen
Also filed as: JENSEN RONALD J · JENSEN RONALD JAMES
17 granted patents·1 pending application·821 citations·filing 1987–2013
95Inventor score
Top patents by PatentIndex Score
18 records- 0194US6005778AChip stacking and capacitor mounting arrangement including spacersHONEYWELL INC·Filed 1996·Granted Dec 21, 1999·294 cites·23 claims
- 0293US8354743B2Multi-tiered integrated circuit packageHONEYWELL INT INC·Filed 2010·Granted Jan 15, 2013·22 cites·20 claims
- 0392US4821197AApparatus and method for parts assemblyOUTBOARD MARINE CORP·Filed 1987·Granted Apr 11, 1989·95 cites·27 claims
- 0491US8362607B2Integrated circuit package including a thermally and electrically conductive package lidHONEYWELL INT INC·Filed 2009·Granted Jan 29, 2013·25 cites·19 claims
- 0590US5453701ABare die test and burn-in deviceHONEYWELL INC·Filed 1994·Granted Sep 26, 1995·76 cites·21 claims
- 0689US5998867ARadiation enhanced chip encapsulantHONEYWELL INC·Filed 1996·Granted Dec 7, 1999·116 cites·37 claims
- 0787US6657134B2Stacked ball grid arrayHONEYWELL INT INC·Filed 2001·Granted Dec 2, 2003·55 cites·24 claims
- 0886US7095226B2Vertical die chip-on-boardHONEYWELL INT INC·Filed 2004·Granted Aug 22, 2006·47 cites·31 claims
- 0982US7868362B2SOI on package hypersensitive sensorHONEYWELL INT INC·Filed 2008·Granted Jan 11, 2011·10 cites·20 claims
- 1080US5049786AHigh energy ignitor power circuitCOEN CO·Filed 1990·Granted Sep 17, 1991·25 cites·28 claims
- 1176US7700409B2Method and system for stacking integrated circuitsHONEYWELL INT INC·Filed 2007·Granted Apr 20, 2010·8 cites·9 claims
- 1272US8459112B2Systems and methods for three dimensional sensorsRIEGER RYAN W·Filed 2011·Granted Jun 11, 2013·4 cites·10 claims
- 1372US7635916B2Integrated circuit package with top-side conduction coolingHONEYWELL INT INC·Filed 2007·Granted Dec 22, 2009·5 cites·19 claims
- 1459US5029095AApparatus and method for parts assemblyOUTBOARD MARINE CORP·Filed 1989·Granted Jul 2, 1991·15 cites·20 claims
- 1558US6027948AMethod to permit high temperature assembly processes for magnetically sensitive devicesHONEYWELL INT INC·Filed 1997·Granted Feb 22, 2000·24 cites·14 claims
- 1645US7965094B2Packaged die heaterHONEYWELL INT INC·Filed 2008·Granted Jun 21, 2011·0 cites·20 claims
- 1743US2015145136A1Vertically connected integrated circuitsHONEYWELL INT INC·Filed 2013·Application pending·0 cites
- 1839US7863720B2Method and system for stacking integrated circuitsHONEYWELL INT INC·Filed 2004·Granted Jan 4, 2011·0 cites·17 claims
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