Inventor · disambiguated record
Jun So Pak
Also filed as: PAK JUN SO
5 granted patents·1 pending application·3 citations·filing 2013–2023
62Inventor score
Top patents by PatentIndex Score
6 records- 0174US9459309B2Test device, semiconductor device and testing method thereofSK HYNIX INC·Filed 2013·Granted Oct 4, 2016·3 cites·8 claims
- 0255US2024194568A1Substrate and semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 0349US11205614B2Stack packagesSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Dec 21, 2021·0 cites·20 claims
- 0448US11764182B2Semiconductor package and semiconductor device including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Sep 19, 2023·0 cites·20 claims
- 0547US11080460B2Method of modeling high speed channel in semiconductor package, method of designing semiconductor package using the same and method of manufacturing semiconductor package using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Aug 3, 2021·0 cites·20 claims
- 0643US11257741B2Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Feb 22, 2022·0 cites·18 claims
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →