Inventor · disambiguated record
Jui Hsieh Lai
Also filed as: LAI JUI-HSIEH
45 granted patents·1 pending application·144 citations·filing 2013–2025
97Inventor score
Top patents by PatentIndex Score
46 records- 0197US10267988B2Photonic package and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·24 cites·20 claims
- 0296US9041015B2Package structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 26, 2015·17 cites·21 claims
- 0393US10459159B2Photonic package and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 29, 2019·7 cites·20 claims
- 0492US9335473B2Package structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted May 10, 2016·7 cites·20 claims
- 0592US8976833B2Light coupling device and methods of forming sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Mar 10, 2015·11 cites·20 claims
- 0691US10948668B2Package structure for optical fiber and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 16, 2021·2 cites·20 claims
- 0790US10790254B2Chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Sep 29, 2020·6 cites·20 claims
- 0890US9857309B2Bio-chip package with waveguide integrated spectrometerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 2, 2018·3 cites·20 claims
- 0990US9405063B2Integrated metal gratingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 2, 2016·6 cites·20 claims
- 1089US10985125B2Chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Apr 20, 2021·2 cites·20 claims
- 1189US10161875B2Bio-chip package with waveguide integrated spectrometerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·2 cites·20 claims
- 1289US9419156B2Package and method for integration of heterogeneous integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 16, 2016·6 cites·18 claims
- 1388US11150404B2Photonic package and method forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Oct 19, 2021·4 cites·20 claims
- 1488US9575249B2Method of making a metal grating in a waveguide and device formedTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 21, 2017·6 cites·20 claims
- 1586US9806069B2Semiconductor device and method of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 31, 2017·3 cites·20 claims
- 1686US9423578B2Semiconductor device and method of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 23, 2016·5 cites·20 claims
- 1785US9478939B2Light coupling device and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 25, 2016·4 cites·20 claims
- 1884US10276471B2Package and method for integration of heterogeneous integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 30, 2019·2 cites·20 claims
- 1984US9478475B2Apparatus and package structure of optical chipTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 25, 2016·3 cites·20 claims
- 2084US9410893B2Bio-chip package with waveguide integrated spectrometerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 9, 2016·5 cites·20 claims
- 2183US10527788B2Package structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jan 7, 2020·2 cites·20 claims
- 2282US10748825B2Package and method for integration of heterogeneous integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 18, 2020·2 cites·20 claims
- 2382US10061079B2Method of making a metal grating in a waveguide and device formedTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Aug 28, 2018·2 cites·20 claims
- 2482US2025293051A1Package structure with underfillTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 2580US10261248B2Package structure and methods of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Apr 16, 2019·2 cites·20 claims
- 2680US9099623B2Manufacture including substrate and package structure of optical chipTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 4, 2015·3 cites·21 claims
- 2779US11630271B2Package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Apr 18, 2023·0 cites·20 claims
- 2879US9093449B2Apparatus and method for chip placement and moldingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jul 28, 2015·4 cites·20 claims
- 2978US10866361B2Method of making a metal grating in a waveguide and device formedTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Dec 15, 2020·1 cites·20 claims
- 3076US11060977B2Bio-chip package with waveguide integrated spectrometerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jul 13, 2021·0 cites·20 claims
- 3174US12362196B2Package structure with underfillTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Jul 15, 2025·0 cites·20 claims
- 3274US11428879B2Method for forming a package structure for optical fiberTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Aug 30, 2022·0 cites·20 claims
- 3373US10508993B2Bio-chip package with waveguide integrated spectrometerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 17, 2019·0 cites·20 claims
- 3472US9228896B2Optical spectroscopy device, process of making the same, and method of using the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jan 5, 2016·2 cites·20 claims
- 3567US9368375B2Apparatus and method for self-aligning chip placement and levelingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 14, 2016·1 cites·25 claims
- 3665US10840231B2Semiconductor device and method of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 17, 2020·0 cites·20 claims
- 3763US10656351B1Package structure for optical fiber and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted May 19, 2020·0 cites·20 claims
- 3862US10515942B2Semiconductor device and method of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·0 cites·20 claims
- 3962US10502894B2Method of making a metal grating in a waveguide and device formedTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 10, 2019·0 cites·20 claims
- 4061US11328936B2Structure and formation method of package structure with underfillTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted May 10, 2022·0 cites·20 claims
- 4159US10157901B2Semiconductor device and method of manufacturingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·0 cites·20 claims
- 4258US9865481B2Package and method for integration of heterogeneous integrated circuitsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Jan 9, 2018·0 cites·20 claims
- 4357US9799528B2Apparatus and package structure of optical chipTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 24, 2017·0 cites·20 claims
- 4457US9459144B2Optical spectroscopy device, process of making the same, and method of using the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 4, 2016·0 cites·20 claims
- 4555US9530673B2Apparatus and method for self-aligning chip placement and levelingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 27, 2016·0 cites·20 claims
- 4649US10269694B2Apparatus and method for chip placement and moldingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Apr 23, 2019·0 cites·20 claims
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