Inventor

SU LI-LIN

TW20 patents

⚠️ This page may combine multiple inventors who share the name “SU LI-LIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SU LI-LIN

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor device and manufacturing method thereof

Structure and formation method of interconnection structure of semiconductor device

Copper contact plugs with barrier layers

Multi-metal fill with self-aligned patterning and dielectric with voids

Semiconductor device and manufacturing method thereof

Trench liner for removing impurities in a non-copper trench

Integrated circuit interconnect structures with air gaps

Multi-metal fill with self-aligned patterning and dielectric with voids

Multi-metal fill with self-aligned patterning and dielectric with voids

Copper contact plugs with barrier layers

Integrated circuit interconnect structures with air gaps

Semiconductor device and manufacturing method thereof

Copper contact plugs with barrier layers

Trench liner for removing impurities in a non-copper trench

TAIWAN SEMICONDUCTOR MFG

Multi-step Cu seed layer formation for improving sidewall coverage

High performance metallization cap layer

Composite barrier layer

Method for forming composite barrier layer

SU LI-LIN

Copper contact plugs with barrier layers

In situ Cu seed layer formation for improving sidewall coverage