Inventor
CHAVALI SRI CHAITRA
US4 patents
Patents
4 patentsUS11387175B2Jul 12, 2022
Interposer package-on-package (PoP) with solder array thermal contacts
INTEL CORP6 citations72
US11196165B2Dec 7, 2021
Low z-height, ultra-low dielectric constant air cavity based and multi-core/highly asymmetric antenna substrate architectures for electrical performance improvements in 5G mm-wave applications
INTEL CORP0 citations55
US11611164B2Mar 21, 2023
Wideband multi-pin edge connector for radio frequency front end module
INTEL CORP0 citations50
US10553453B2Feb 4, 2020
Systems and methods for semiconductor packages using photoimageable layers
INTEL CORP0 citations48