Inventor

SMAYLING MICHAEL C

US225 patents

⚠️ This page may combine multiple inventors who share the name “SMAYLING MICHAEL C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SMAYLING MICHAEL C

BECKER SCOTT T

Semiconductor device with gate level including gate electrode conductors for transistors of first type and transistors of second type with some gate electrode conductors of different length

Semiconductor device with dynamic array sections defined and placed according to manufacturing assurance halos

Semiconductor device with linearly restricted gate level region including four transistors of first type and four transistors of second type with gate defining shapes of different length

Semiconductor device including transistor forming linear shapes including gate portions and extending portions of different size

Semiconductor device including at least six transistor forming linear shapes including at least two different gate contact connection distances

Semiconductor device with gate level including transistors of first type and transistors of second type with corresponding gate contact placement restriction

Semiconductor device with gate level including four transistors of first type and four transistors of second type separated by non-diffusion region with restricted gate contact placement over separating non-diffusion region

Semiconductor device including at least six transistor forming linear shapes with at least two transistor forming linear shapes having offset ends

Semiconductor device with linearly restricted gate level region including two transistors of first type and two transistors of second type with offset gate contacts

Semiconductor device including two transistors of first type having gates formed by conductors of different length respectively aligned with two transistors of second type having gates formed by conductors of different length

Semiconductor device including at least six transistor forming linear shapes including at least two transistor forming linear shapes having different extension distances beyond gate contact

Semiconductor device with gate level including four transistors of first type and four transistors of second type separated by non-diffusion region and having at least two gate contacts positioned outside separating non-diffusion region

Semiconductor device with linearly restricted gate level region including four serially connected transistors of first type and four serially connected transistors of second type separated by non-diffusion region

Integrated circuit including gate electrode level region including at least three linear-shaped conductive structures of equal length having aligned ends and positioned at equal pitch and forming multiple gate electrodes of transistors of different type

Electrodes of transistors with at least two linear-shaped conductive structures of different length

Integrated circuit including gate electrode level region including at least four linear-shaped conductive structures of equal length having aligned ends and positioned at equal pitch and forming multiple gate electrodes of transistors of different type

Integrated circuit including at least three linear-shaped conductive structures of different length each forming gate of different transistor

Integrated circuit having gate electrode level region including at least four linear-shaped conductive structures with some outer-contacted linear-shaped conductive structures having larger outer extending portion than inner extending portion

Integrated circuit including linear-shaped conductive structures that have gate portions and extending portions of different size

Integrated circuit having gate electrode level region including at least seven linear-shaped conductive structures at equal pitch including linear-shaped conductive structure forming transistors of two different types and at least three linear-shaped conductive structures having aligned ends

Integrated circuit including at least three linear-shaped conductive structures at equal pitch including linear-shaped conductive structure having non-gate portion length greater than gate portion length

Integrated circuit including a linear-shaped conductive structure forming one gate electrode and having length greater than or equal to one-half the length of linear-shaped conductive structure forming two gate electrodes

Integrated circuit including at least six linear-shaped conductive structures forming gate electrodes and including four conductive contacting structures having at least two different connection distances

Integrated circuit including at least six linear-shaped conductive structures forming gate electrodes of transistors with at least two different extension distances beyond conductive contacting structures

Integrated circuit including at least six linear-shaped conductive structures forming gate electrodes of transistors with at least two linear-shaped conductive structures of different length

Integrated circuit with gate electrode level including at least six linear-shaped conductive structures forming gate electrodes of transisters with at least one pair of linear-shaped conductive structures having offset ends

Integrated circuit including at least six linear-shaped conductive structive structures at equal pitch including at least two linear-shaped conductive structures having non-gate portions of different length

Integrated circuit with gate electrode level including at least four linear-shaped conductive structures of equal length and equal pitch with linear-shaped conductive structure forming one transistor

Method of fabricating integrated circuit including at least six linear-shaped conductive structures at equal pitch including at least two linear-shaped conductive structures having non-gate portions of different length

Integrated circuit device with linearly defined gate electrode level region and shared diffusion region of first type connected to shared diffusion region of second type through at least two interconnect levels

Integrated circuit device with gate level region including non-gate linear conductive segment positioned within 965 nanometers of four transistors of first type and four transistors of second type

Method for fabricating integrated circuit having at least three linear-shaped gate electrode level conductive features of equal length positioned side-by-side at equal pitch

Integrated circuit device and associated layout including gate electrode level region of 965 NM radius with linear-shaped conductive segments on fixed pitch

Integrated circuit device with gate electrode level region including two side-by-side ones of at least three linear-shaped conductive structures electrically connected to each other through non-gate level

Integrated circuit device and associated layout including linear gate electrodes of different transistor types next to linear-shaped non-gate conductive segment

Integrated circuit with gate electrode level region including at least four linear-shaped conductive structures forming gate electrodes of transistors and including extending portions of at least two different sizes

Method for fabricating integrated circuit including separated diffusion regions of different type each having four gate electrodes with each of two complementary gate electrode pairs formed from respective linear condcutive segment

Method for fabricating integrated circuit with gate electrode level portion including at least two complementary transistor forming linear conductive segments and at least one non-gate linear conductive segment

Integrated circuit device with gate level region including at least three linear-shaped conductive segments having offset line ends and forming three transistors of first type and one transistor of second type

Method for fabricating integrated circuit having three or more linear-shaped gate electrode level conductive segments of both equal length and equal pitch

Integrated circuit with gate electrode level region including multiple linear-shaped conductive structures forming gate electrodes of transistors and including uniformity extending portions of different size

Method for fabricating integrated circuit with gate electrode level region including two side-by-side ones of at least three linear-shaped conductive structures electrically connected to each other through non-gate level

Integrated circuit device and associated layout including two pairs of co-aligned complementary gate electrodes with offset gate contact structures

Semiconductor device having at least three linear-shaped electrode level conductive features of equal length positioned side-by-side at equal pitch

TELA INNOVATIONS INC

Semiconductor chip including region having integrated circuit transistor gate electrodes formed by various conductive structures of specified shape and position and method for manufacturing the same

Integrated circuit device including dynamic array section with gate level having linear conductive features on at least three side-by-side lines and uniform line end spacings

Semiconductor device having two pairs of transistors of different types formed from shared linear-shaped conductive features with intervening transistors of common type on equal pitch

Integrated circuit device and associated layout including separated diffusion regions of different type each having four gate electrodes with each of two complementary gate electrode pairs formed from respective linear conductive segment

Semiconductor device and associated layouts having transistors formed from six linear conductive segments with gate electrode-to-gate electrode connection through single interconnect level and common node connection through different interconnect level

Semiconductor device having at least four side-by-side electrodes of equal length and equal pitch with at least two transistor connections to power or ground