Inventor · disambiguated record
Akira Sekino
Also filed as: SEKINO AKIRA
4 granted patents·2 pending applications·33 citations·filing 2004–2020
75Inventor score
Top patents by PatentIndex Score
6 records- 0187US9440793B2Conveyor device for conveying foodMAEKAWA SEISAKUSHO KK·Filed 2013·Granted Sep 13, 2016·8 cites·9 claims
- 0282US9540176B2Conveyor device for conveying foodMAEKAWA SEISAKUSHO KK·Filed 2013·Granted Jan 10, 2017·11 cites·10 claims
- 0369US8567308B2Spiral transfer heat treatment apparatusONOZATO MASAYUKI·Filed 2009·Granted Oct 29, 2013·8 cites·11 claims
- 0457US2020243477A1Die bonding apparatus and die bonding methodFURUKAWA ELECTRIC CO LTD·Filed 2020·Application pending·0 cites
- 0547US2017365578A1Die bonding apparatus and die bonding methodFURUKAWA ELECTRIC CO LTD·Filed 2017·Application pending·0 cites
- 0646US7401696B2Flexible transfer installation and foodstuff transfer system provided with the flexible transfer installationMAEKAWA SEISAKUSHO KK·Filed 2004·Granted Jul 22, 2008·6 cites·6 claims
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