Inventor
NAKAYAMA MASANORI
JP33 patents
⚠️ This page may combine multiple inventors who share the name “NAKAYAMA MASANORI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI INT ELECTRIC INC
15 patentsUS9929005B1Mar 27, 2018
Method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC345 citations98
US9431220B1Aug 30, 2016
Substrate processing apparatus and substrate processing system
HITACHI INT ELECTRIC INC10 citations84
US10671056B2Jun 2, 2020
Substrate processing system
HITACHI INT ELECTRIC INC1 citations62
US11384431B2Jul 12, 2022
Substrate processing apparatus
HITACHI INT ELECTRIC INC1 citations61
US9059229B2Jun 16, 2015
Substrate processing apparatus and method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC2 citations61
US9735068B2Aug 15, 2017
Method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC1 citations52
US12506002B2Dec 23, 2025
Method of manufacturing semiconductor device using plasma to modify surface of silicon-containing films exposed in trench structure, and recording medium
HITACHI INT ELECTRIC INC0 citations51
US10355098B2Jul 16, 2019
Method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC0 citations51
US9966238B2May 8, 2018
Method for manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording medium
HITACHI INT ELECTRIC INC0 citations51
US9831249B2Nov 28, 2017
Method of manufacturing semiconductor device and non-transitory computer-readable recording medium
HITACHI INT ELECTRIC INC0 citations50
US10910214B2Feb 2, 2021
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
HITACHI INT ELECTRIC INC0 citations47
US10090322B2Oct 2, 2018
Method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC0 citations42
US10453676B2Oct 22, 2019
Semiconductor device manufacturing method and recording medium
HITACHI INT ELECTRIC INC0 citations41
US9978653B2May 22, 2018
Method of manufacturing semiconductor device
HITACHI INT ELECTRIC INC0 citations41
US7795156B2Sep 14, 2010
Producing method of semiconductor device
HITACHI INT ELECTRIC INC0 citations40
KOKUSAI ELECTRIC CORP
15 patentsUS11905596B2Feb 20, 2024
Method of manufacturing semiconductor device, and recording medium
KOKUSAI ELECTRIC CORP2 citations72
US12195854B2Jan 14, 2025
Substrate processing apparatus, method of processing substrate, method of manufacturing semiconductor device, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US11726456B2Aug 15, 2023
Substrate processing system
KOKUSAI ELECTRIC CORP0 citations62
US11155922B2Oct 26, 2021
Method of manufacturing semiconductor device, and recording medium
KOKUSAI ELECTRIC CORP0 citations62
US11145491B2Oct 12, 2021
Substrate processing apparatus, method of manufacturing semiconductor device and non-transitory computer-readable recording medium
KOKUSAI ELECTRIC CORP1 citations61
US12154826B2Nov 26, 2024
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations59
US11664275B2May 30, 2023
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP1 citations59
US12040161B2Jul 16, 2024
Method of manufacturing semiconductor device, substrate processing apparatus, and recording medium
KOKUSAI ELECTRIC CORP0 citations58
US11908682B2Feb 20, 2024
Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording medium
KOKUSAI ELECTRIC CORP0 citations58
US11081362B2Aug 3, 2021
Method of manufacturing semiconductor device, and recording medium
KOKUSAI ELECTRIC CORP0 citations58
US12106998B2Oct 1, 2024
Substrate processing apparatus, substrate processing method, non-transitory computer-readable recording medium and method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP0 citations52
US11189483B2Nov 30, 2021
Method of manufacturing semiconductor device and non-transitory computer-readable recording medium
KOKUSAI ELECTRIC CORP0 citations49
US11152476B2Oct 19, 2021
Method of manufacturing semiconductor device and non-transitory computer-readable recording medium
KOKUSAI ELECTRIC CORP0 citations49
US12575347B2Mar 10, 2026
Method of manufacturing semiconductor device, substrate processing apparatus and non-transitory computer-readable recording medium
KOKUSAI ELECTRIC CORP0 citations48
US10796900B2Oct 6, 2020
Method of manufacturing semiconductor device
KOKUSAI ELECTRIC CORP0 citations39