Inventor
PARK CHONG-IL
US5 patents
Patents
5 patentsUS6204448B1Mar 20, 2001
High frequency microwave packaging having a dielectric gap
KYOCERA AMERICA INC91 citations95
US6441697B1Aug 27, 2002
Ultra-low-loss feedthrough for microwave circuit package
KYOCERA AMERICA INC32 citations89
US5137767AAug 11, 1992
Partially coated assembly structure and method for making a ceramic lid for hermetic sealing of an eprom circuit
KYOCERA AMERICA INC8 citations69
US5160747ANov 3, 1992
Apparatus for manufacturing ceramic chip-resistant chamfered integrated circuit package
KYOCERA AMERICA INC9 citations67
US5095360AMar 10, 1992
Ceramic chip-resistant chamfered integrated circuit package
KYOCERA AMERICA INC12 citations67