P

Inventor

LIU CHIN-MING

TW9 patents
⚠️ This page may combine multiple inventors who share the name “LIU CHIN-MING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PHOENIX PIONEER TECHNOLOGY CO LTD

3 patents
US9805996B2Oct 31, 2017

Substrate structure and manufacturing method thereof

PHOENIX PIONEER TECHNOLOGY CO LTD2 citations71
US9583436B2Feb 28, 2017

Package apparatus and manufacturing method thereof

PHOENIX PIONEER TECHNOLOGY CO LTD5 citations71
US9831217B2Nov 28, 2017

Method of fabricating package substrates

PHOENIX PIONEER TECHNOLOGY CO LTD1 citations50

PHOENIX & CORP

2 patents
US10002823B2Jun 19, 2018

Packaging substrate and method of fabricating the same

PHOENIX & CORP2 citations71
US11031329B2Jun 8, 2021

Method of fabricating packaging substrate

PHOENIX & CORP0 citations60

LEADING INTERCONNECT SEMICONDUCTOR TECH QINHUANGDAO CO LTD

2 patents
US12418989B2Sep 16, 2025

Packaged circuit structure

LEADING INTERCONNECT SEMICONDUCTOR TECH QINHUANGDAO CO LTD0 citations56
US11683888B2Jun 20, 2023

Method for manufacturing a packaged circuit structure

LEADING INTERCONNECT SEMICONDUCTOR TECH QINHUANGDAO CO LTD0 citations56

UNIMICRON TECHNOLOGY CORP

1 patent
US8354598B2Jan 15, 2013

Packaging substrate and fabrication method thereof

UNIMICRON TECHNOLOGY CORP6 citations70

LIU CHIN-MING

1 patent
US8168513B2May 1, 2012

Method for fabricating packaging substrate

LIU CHIN-MING4 citations54