Inventor
LIM SUNG KYU
US6 patents
Patents
6 patentsUS9741691B2Aug 22, 2017
Power delivery network (PDN) design for monolithic three-dimensional (3-D) integrated circuit (IC)
QUALCOMM INC14 citations82
US9256246B1Feb 9, 2016
Clock skew compensation with adaptive body biasing in three-dimensional (3D) integrated circuits (ICs) (3DICs)
QUALCOMM INC10 citations82
US9869713B2Jan 16, 2018
Through-silicon via (TSV) crack sensors for detecting TSV cracks in three-dimensional (3D) integrated circuits (ICs) (3DICs), and related methods and systems
QUALCOMM INC2 citations71
US9483598B2Nov 1, 2016
Intellectual property block design with folded blocks and duplicated pins for 3D integrated circuits
QUALCOMM INC2 citations61
US9508615B2Nov 29, 2016
Clock tree synthesis for low cost pre-bond testing of 3D integrated circuits
QUALCOMM INC1 citations51
US9626311B2Apr 18, 2017
Memory controller placement in a three-dimensional (3D) integrated circuit (IC) (3DIC) employing distributed through-silicon-via (TSV) farms
QUALCOMM INC0 citations35