Inventor
RADOJCIC RATIBOR
US14 patents
⚠️ This page may combine multiple inventors who share the name “RADOJCIC RATIBOR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
QUALCOMM INC
9 patentsUS9704796B1Jul 11, 2017
Integrated device comprising a capacitor that includes multiple pins and at least one pin that traverses a plate of the capacitor
QUALCOMM INC22 citations93
US9633977B1Apr 25, 2017
Integrated device comprising flexible connector between integrated circuit (IC) packages
QUALCOMM INC32 citations93
US9418877B2Aug 16, 2016
Integrated device comprising high density interconnects in inorganic layers and redistribution layers in organic layers
QUALCOMM INC14 citations84
US10971476B2Apr 6, 2021
Bottom package with metal post interconnections
QUALCOMM INC4 citations73
US9869713B2Jan 16, 2018
Through-silicon via (TSV) crack sensors for detecting TSV cracks in three-dimensional (3D) integrated circuits (ICs) (3DICs), and related methods and systems
QUALCOMM INC2 citations71
US9881859B2Jan 30, 2018
Substrate block for PoP package
QUALCOMM INC1 citations52
US8691707B2Apr 8, 2014
Voltage switchable dielectric for die-level electrostatic discharge (ESD) protection
QUALCOMM INC0 citations52
US9853446B2Dec 26, 2017
Integrated circuit (IC) package comprising electrostatic discharge (ESD) protection
QUALCOMM INC1 citations51
US9285418B2Mar 15, 2016
Method and apparatus for characterizing thermal marginality in an integrated circuit
QUALCOMM INC0 citations48