Inventor
GUO MEI-HUI
TW4 patents
Patents
4 patentsUS10303823B2May 28, 2019
Defect detection method for 3D chip and system using the same
UNIV I SHOU11 citations79
US11748545B2Sep 5, 2023
Method and electronic device for configuring signal pads between three-dimensional stacked chips
UNIV I SHOU0 citations50
US10776559B2Sep 15, 2020
Defect detection method for multilayer daisy chain structure and system using the same
UNIV I SHOU0 citations36
US10063282B1Aug 28, 2018
Chip-to-chip signal transmission system and method for arranging chips thereof
UNIV I SHOU0 citations36