P

Inventor

JIANG Fa-Shen

TW47 patents
⚠️ This page may combine multiple inventors who share the name “JIANG Fa-Shen”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

46 patents
US10916697B2Feb 9, 2021

Memory device and method of manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations84
US10910560B2Feb 2, 2021

RRAM structure

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US10622555B2Apr 14, 2020

Film scheme to improve peeling in chalcogenide based PCRAM

TAIWAN SEMICONDUCTOR MFG CO LTD6 citations84
US11961545B2Apr 16, 2024

Circuit design and layout with high embedded memory density

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11856801B2Dec 26, 2023

Threshold voltage-modulated memory device using variable-capacitance and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11545202B2Jan 3, 2023

Circuit design and layout with high embedded memory density

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11527717B2Dec 13, 2022

Resistive memory cell having a low forming voltage

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11430951B2Aug 30, 2022

Resistive memory cell with switching layer comprising one or more dopants

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11404638B2Aug 2, 2022

Multi-doped data storage structure configured to improve resistive memory cell performance

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11152568B2Oct 19, 2021

Top-electrode barrier layer for RRAM

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10818544B2Oct 27, 2020

Method to enhance electrode adhesion stability

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US12424256B2Sep 23, 2025

Circuit design and layout with high embedded memory density

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12414484B2Sep 9, 2025

RRAM structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12310036B2May 20, 2025

Threshold voltage-modulated memory device using variable-capacitance and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12261197B2Mar 25, 2025

Diffusion barrier layer in top electrode to increase break down voltage

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12232336B2Feb 18, 2025

Threshold voltage-modulated memory device using variable-capacitance and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12218005B2Feb 4, 2025

Integrated circuit device

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US12178147B2Dec 24, 2024

Semiconductor device and method for manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12075636B2Aug 27, 2024

Threshold voltage-modulated memory device using variable-capacitance and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11963468B2Apr 16, 2024

Rram structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11532698B2Dec 20, 2022

Diffusion barrier layer in top electrode to increase break down voltage

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US11482668B2Oct 25, 2022

RRAM structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11476416B2Oct 18, 2022

Semiconductor device and method for manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12507601B2Dec 23, 2025

Thermal dispersion layer in programmable metallization cell

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12364171B2Jul 15, 2025

Resistive memory cell with switching layer comprising one or more dopants

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12295270B2May 6, 2025

RRAM device with improved performance

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12239035B2Feb 25, 2025

Resistive memory cell having a low forming voltage

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12232434B2Feb 18, 2025

Multi-doped data storage structure configured to improve resistive memory cell performance

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12225834B2Feb 11, 2025

Method for forming semiconductor structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12114582B2Oct 8, 2024

Top-electrode barrier layer for RRAM

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12102019B2Sep 24, 2024

Data storage structure for improving memory cell reliability

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12075626B2Aug 27, 2024

Memory window of MFM MOSFET for small cell size

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11991937B2May 21, 2024

Semiconductor device and method for manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11967611B2Apr 23, 2024

Multilayer structure, capacitor structure and electronic device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11895933B2Feb 6, 2024

Resistive memory cell with switching layer comprising one or more dopants

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11894267B2Feb 6, 2024

Method for fabricating integrated circuit device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11800823B2Oct 24, 2023

Method for manufacturing thermal dispersion layer in programmable metallization cell

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11723212B2Aug 8, 2023

Memory window of MFM MOSFET for small cell size

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11716915B2Aug 1, 2023

Top-electrode barrier layer for RRAM

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11716913B2Aug 1, 2023

Data storage structure for improving memory cell reliability

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11437573B2Sep 6, 2022

Semiconductor device and method for manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11309491B2Apr 19, 2022

Data storage structure for improving memory cell reliability

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11165021B2Nov 2, 2021

RRAM device with improved performance

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11038101B2Jun 15, 2021

Semiconductor structure having a phase change memory device

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11024800B2Jun 1, 2021

Film scheme to improve peeling in chalcogenide based PCRAM

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12334317B2Jun 17, 2025

Remote plasma ultraviolet enhanced deposition

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52

WINBOND ELECTRONICS CORP

1 patent