Inventor
LIU KUANG-HSING
TW3 patents
⚠️ This page may combine multiple inventors who share the name “LIU KUANG-HSING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
2 patentsUS6660125B2Dec 9, 2003
Sputter PM procedures with polish tool to effectively remove metal defects from target surface nodules (residue)
TAIWAN SEMICONDUCTOR MFG0 citations46
US6358851B1Mar 19, 2002
Sputter PM procedures with polish tool to effectively remove metal defects from target surface nodules (residue)
TAIWAN SEMICONDUCTOR MFG1 citations46