Inventor
CHEN TA-BIN
TW2 patents
Patents
2 patentsUS6660125B2Dec 9, 2003
Sputter PM procedures with polish tool to effectively remove metal defects from target surface nodules (residue)
TAIWAN SEMICONDUCTOR MFG0 citations46
US6358851B1Mar 19, 2002
Sputter PM procedures with polish tool to effectively remove metal defects from target surface nodules (residue)
TAIWAN SEMICONDUCTOR MFG1 citations46