Inventor
CHENG JOHNNY
TW6 patents
Patents
6 patentsUS6504238B2Jan 7, 2003
Leadframe with elevated small mount pads
TEXAS INSTRUMENTS INC37 citations89
US6249963B1Jun 26, 2001
System and method for coupling conductive pellets to a component of an integrated circuit
TEXAS INSTRUMENTS INC15 citations80
US6989606B2Jan 24, 2006
BGA substrate via structure
TEXAS INSTRUMENTS INC6 citations72
US6596620B2Jul 22, 2003
BGA substrate via structure
TEXAS INSTRUMENTS INC6 citations72
US6441486B1Aug 27, 2002
BGA substrate via structure
TEXAS INSTRUMENTS INC4 citations61
US6265769B1Jul 24, 2001
Double-sided chip mount package
TEXAS INSTRUMENTS INC5 citations55