Inventor
IIOKA SHINJI
JP4 patents
Patents
4 patentsUS6462148B1Oct 8, 2002
Adhesive film of quinoline polymer and bismaleimide
HITACHI CHEMICAL CO LTD23 citations92
US6523446B1Feb 25, 2003
Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
HITACHI CHEMICAL CO LTD13 citations81
US7449076B2Nov 11, 2008
Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
HITACHI CHEMICAL CO LTD0 citations49
US7273654B2Sep 25, 2007
Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
HITACHI CHEMICAL CO LTD0 citations49