Inventor
YANAGISAWA SATORU
JP3 patents
Patents
3 patentsUS6523446B1Feb 25, 2003
Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
HITACHI CHEMICAL CO LTD13 citations81
US7449076B2Nov 11, 2008
Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
HITACHI CHEMICAL CO LTD0 citations49
US7273654B2Sep 25, 2007
Punched adhesive tape for semiconductor, method of manufacturing lead frame with the adhesive tape, lead frame with the adhesive tape, and semiconductor device comprising the lead frame
HITACHI CHEMICAL CO LTD0 citations49