Inventor
LAI ZAO-KUO
TW5 patents
⚠️ This page may combine multiple inventors who share the name “LAI ZAO-KUO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
PHOENIX PREC TECHNOLOGY CORP
4 patentsUS7507915B2Mar 24, 2009
Stack structure of carrier boards embedded with semiconductor components and method for fabricating the same
PHOENIX PREC TECHNOLOGY CORP31 citations91
US7754598B2Jul 13, 2010
Method for manufacturing coreless packaging substrate
PHOENIX PREC TECHNOLOGY CORP10 citations82
US7323762B2Jan 29, 2008
Semiconductor package substrate with embedded resistors and method for fabricating the same
PHOENIX PREC TECHNOLOGY CORP13 citations81
US7135377B1Nov 14, 2006
Semiconductor package substrate with embedded resistors and method for fabricating same
PHOENIX PREC TECHNOLOGY CORP5 citations60