Inventor
BUPP JAMES R
US7 patents
Patents
7 patentsUS6639155B1Oct 28, 2003
High performance packaging platform and method of making same
IBM62 citations96
US5519936AMay 28, 1996
Method of making an electronic package with a thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto
IBM113 citations96
US5633533AMay 27, 1997
Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto
IBM58 citations94
US5561323AOct 1, 1996
Electronic package with thermally conductive support member having a thin circuitized substrate and semiconductor device bonded thereto
IBM67 citations94
US4478883AOct 23, 1984
Conditioning of a substrate for electroless direct bond plating in holes and on surfaces of a substrate
IBM57 citations93
US4554182ANov 19, 1985
Method for conditioning a surface of a dielectric substrate for electroless plating
IBM50 citations91
US4400618AAug 23, 1983
Method of detecting and analyzing damage in printed circuit boards
IBM32 citations90