Inventor
WAKISAWA YUUJI
JP2 patents
Patents
2 patentsUS5585672ADec 17, 1996
Semiconductor module with an improved heat sink/insulation plate arrangement
HITACHI LTD23 citations90
US5446318AAug 29, 1995
Semiconductor module with a plurality of power devices mounted on a support base with an improved heat sink/insulation plate arrangement
HITACHI LTD29 citations90