Inventor
SANE SANDEEP
US6 patents
⚠️ This page may combine multiple inventors who share the name “SANE SANDEEP”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
3 patentsUS7781260B2Aug 24, 2010
Methods of forming nano-coatings for improved adhesion between first level interconnects and epoxy under-fills in microelectronic packages and structures formed thereby
INTEL CORP14 citations82
US12038858B2Jul 16, 2024
Processor package with universal optical input/output
INTEL CORP0 citations58
US10531575B2Jan 7, 2020
Systems and methods for replaceable bail grid array (BGA) packages on board substrates
INTEL CORP0 citations46
MAHAJAN RAVI
2 patentsUS8064224B2Nov 22, 2011
Microelectronic package containing silicon patches for high density interconnects, and method of manufacturing same
MAHAJAN RAVI155 citations95
US8441809B2May 14, 2013
Microelectronic package containing silicon connecting region for high density interconnects, and method of manufacturing same
MAHAJAN RAVI14 citations81