Inventor

CHAN CHEW B

US2 patents

⚠️ This page may combine multiple inventors who share the name “CHAN CHEW B”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

JI QING

1 patent

US8075721B2Dec 13, 2011

Low exothermic thermosetting resin compositions useful as underfill sealants and having reworkability

JI QING2 citations47

CHAN CHEW B

1 patent

US8273606B2Sep 25, 2012

Method of fabricating a semiconductor package using a fluxing underfill composition applied to solder balls in a dip process

CHAN CHEW B0 citations24