Inventor
LEE JUNGBAE
TW16 patents
⚠️ This page may combine multiple inventors who share the name “LEE JUNGBAE”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
15 patentsUS11688706B2Jun 27, 2023
Semiconductor device assembly with embossed solder mask having non-planar features and associated methods and systems
MICRON TECHNOLOGY INC4 citations73
US11887938B2Jan 30, 2024
Semiconductor device assemblies with conductive underfill dams for grounding EMI shields and methods for making the same
MICRON TECHNOLOGY INC2 citations71
US11532595B2Dec 20, 2022
Stacked semiconductor dies for semiconductor device assemblies
MICRON TECHNOLOGY INC2 citations71
US11342277B2May 24, 2022
Semiconductor device assemblies with conductive underfill dams for grounding EMI shields and methods for making the same
MICRON TECHNOLOGY INC2 citations71
US11094668B2Aug 17, 2021
Solderless interconnect for semiconductor device assembly
MICRON TECHNOLOGY INC2 citations71
US12341128B2Jun 24, 2025
Stacked semiconductor dies for semiconductor device assemblies
MICRON TECHNOLOGY INC0 citations61
US11923332B2Mar 5, 2024
Semiconductor die with capillary flow structures for direct chip attachment
MICRON TECHNOLOGY INC0 citations61
US11810894B2Nov 7, 2023
Solderless interconnect for semiconductor device assembly
MICRON TECHNOLOGY INC0 citations61
US11264349B2Mar 1, 2022
Semiconductor die with capillary flow structures for direct chip attachment
MICRON TECHNOLOGY INC0 citations61
US11942455B2Mar 26, 2024
Stacked semiconductor dies for semiconductor device assemblies
MICRON TECHNOLOGY INC0 citations60
US11362071B2Jun 14, 2022
Stacked semiconductor dies for semiconductor device assemblies
MICRON TECHNOLOGY INC0 citations60
US11682563B2Jun 20, 2023
Semiconductor device assembly with graded modulus underfill and associated methods and systems
MICRON TECHNOLOGY INC0 citations58
US11404289B2Aug 2, 2022
Semiconductor device assembly with graded modulus underfill and associated methods and systems
MICRON TECHNOLOGY INC0 citations58
US12532774B2Jan 20, 2026
Conductive organic module for semiconductor devices and associated systems and methods
MICRON TECHNOLOGY INC0 citations50
US11621245B2Apr 4, 2023
Microelectronic device packages with EMI shielding, methods of fabricating and related electronic systems
MICRON TECHNOLOGY INC0 citations49