P

Inventor

LIM SHOA SIONG

SG11 patents
⚠️ This page may combine multiple inventors who share the name “LIM SHOA SIONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

ADVANPACK SOLUTIONS PTE LTD

5 patents
US9305868B2Apr 5, 2016

Manufacturing method of forming an etch-back type semiconductor package with locking anchorages

ADVANPACK SOLUTIONS PTE LTD0 citations50
US9059050B2Jun 16, 2015

Manufacturing methods of semiconductor substrate, package and device

ADVANPACK SOLUTIONS PTE LTD0 citations49
US10763133B2Sep 1, 2020

Semiconductor structure and semiconductor package device using the same

ADVANPACK SOLUTIONS PTE LTD0 citations48
US10446457B2Oct 15, 2019

Multi-layer substrate for semiconductor packaging

ADVANPACK SOLUTIONS PTE LTD0 citations47
US10049950B2Aug 14, 2018

Multi-layer substrate for semiconductor packaging

ADVANPACK SOLUTIONS PTE LTD1 citations47

LIM SHOA SIONG

3 patents
US9136215B2Sep 15, 2015

Manufacturing method for semiconductor package

LIM SHOA SIONG2 citations49
US8664750B2Mar 4, 2014

Semiconductor substrate, package and device

LIM SHOA SIONG0 citations46
US9847268B2Dec 19, 2017

Semiconductor package and manufacturing method thereof

LIM SHOA SIONG0 citations36

CHEW HWEE-SENG JIMMY

1 patent
US8917521B2Dec 23, 2014

Etch-back type semiconductor package, substrate and manufacturing method thereof

CHEW HWEE-SENG JIMMY2 citations60

CHEW JIMMY HWEE SENG

1 patent
US10109503B2Oct 23, 2018

Method of manufacturing semiconductor package device

CHEW JIMMY HWEE SENG0 citations41

CHEW HWEE SENG

1 patent
US9120169B2Sep 1, 2015

Method for device packaging

CHEW HWEE SENG0 citations30