Inventor

CHEW HWEE SENG

SG6 patents

⚠️ This page may combine multiple inventors who share the name “CHEW HWEE SENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PEP INNOVATION PTE LTD

2 patents

US12506055B2Dec 23, 2025

Chip packaging method and chip structure

PEP INNOVATION PTE LTD1 citations57

US11990431B2May 21, 2024

Semiconductor structures with via openings and methods of making the same

PEP INNOVATION PTE LTD0 citations45

ADVANPACK SOLUTIONS PTE LTD

2 patents

US10446457B2Oct 15, 2019

Multi-layer substrate for semiconductor packaging

ADVANPACK SOLUTIONS PTE LTD0 citations47

US10049950B2Aug 14, 2018

Multi-layer substrate for semiconductor packaging

ADVANPACK SOLUTIONS PTE LTD1 citations47

PYXIS CF PTE LTD

1 patent

US12183620B2Dec 31, 2024

Apparatus and method for bonding a plurality of dies to a carrier panel

PYXIS CF PTE LTD0 citations37

CHEW HWEE SENG

1 patent

US9120169B2Sep 1, 2015

Method for device packaging

CHEW HWEE SENG0 citations30