Inventor
JACOBSEN LARRY L
US2 patents
Patents
2 patentsUS6130113AOct 10, 2000
Enhanced lamination process between heatspreader to pressure sensitive adhesive (PSA) interface as a step in the semiconductor assembly process
LSI LOGIC CORP14 citations68
US5973398AOct 26, 1999
Semiconductor device and fabrication method employing a palladium-plated heat spreader substrate
LSI LOGIC CORP2 citations57