Inventor
TSAI YI HENG
TW35 patents
⚠️ This page may combine multiple inventors who share the name “TSAI YI HENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
23 patentsUS10944041B1Mar 9, 2021
Hybrid ultrasonic transducer and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD12 citations86
US11767219B2Sep 26, 2023
Semiconductor structure including scribe line structures and method for fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11508902B2Nov 22, 2022
Hybrid ultrasonic transducer and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9859819B2Jan 2, 2018
MEMS structure and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US12297105B2May 13, 2025
Semiconductor structure including scribe line structures and method for fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12082505B2Sep 3, 2024
Integrated heater (and related method) to recover degraded piezoelectric device performance
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11984261B2May 14, 2024
Integration scheme for breakdown voltage enhancement of a piezoelectric metal-insulator-metal device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11736037B2Aug 22, 2023
MEMS structure and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11730058B2Aug 15, 2023
Integrated heater (and related method) to recover degraded piezoelectric device performance
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11107630B2Aug 31, 2021
Integration scheme for breakdown voltage enhancement of a piezoelectric metal-insulator-metal device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11289568B2Mar 29, 2022
Reduction of electric field enhanced moisture penetration by metal shielding
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US9502370B2Nov 22, 2016
Semiconductor bonding structure and process
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations61
US12377441B2Aug 5, 2025
Hybrid ultrasonic transducer system
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US10737936B2Aug 11, 2020
Semiconductor structure and method for fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10541627B2Jan 21, 2020
MEMS structure and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9422153B2Aug 23, 2016
Support structure for TSV in MEMS structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9418849B2Aug 16, 2016
Cavity structure using patterned sacrificial layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10087071B2Oct 2, 2018
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations51
US9446945B2Sep 20, 2016
Isolation structure for MEMS 3D IC integration
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
US9975754B2May 22, 2018
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US9656855B1May 23, 2017
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US9493346B2Nov 15, 2016
Capacitor with planarized bonding for CMOS-MEMS integration
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations41
US9449867B2Sep 20, 2016
VHF etch barrier for semiconductor integrated microsystem
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations41
TAIWAN SEMICONDUCTOR MFG
7 patentsUS9281287B2Mar 8, 2016
Semiconductor bonding structure and process
TAIWAN SEMICONDUCTOR MFG3 citations71
US8343789B2Jan 1, 2013
Microstructure device with an improved anchor
TAIWAN SEMICONDUCTOR MFG2 citations63
US8633554B2Jan 21, 2014
MEMS device etch stop
TAIWAN SEMICONDUCTOR MFG3 citations62
US8368152B2Feb 5, 2013
MEMS device etch stop
TAIWAN SEMICONDUCTOR MFG4 citations62
US8878355B2Nov 4, 2014
Semiconductor bonding structure and process
TAIWAN SEMICONDUCTOR MFG2 citations61
US9266724B2Feb 23, 2016
Method for handling a thin substrate and for substrate capping
TAIWAN SEMICONDUCTOR MFG0 citations52
US8704317B2Apr 22, 2014
Microstructure device with an improved anchor
TAIWAN SEMICONDUCTOR MFG0 citations52