Inventor
STACY WILL
US6 patents
⚠️ This page may combine multiple inventors who share the name “STACY WILL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NUVOTRONICS INC
4 patentsUS9888600B2Feb 6, 2018
Substrate-free interconnected electronic mechanical structural systems
NUVOTRONICS INC13 citations90
US10361471B2Jul 23, 2019
Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems
NUVOTRONICS INC1 citations70
US10193203B2Jan 29, 2019
Structures and methods for interconnects and associated alignment and assembly mechanisms for and between chips, components, and 3D systems
NUVOTRONICS INC2 citations70
US10257951B2Apr 9, 2019
Substrate-free interconnected electronic mechanical structural systems
NUVOTRONICS INC0 citations49
NUVOTRONICS LLC
2 patentsUS9306254B1Apr 5, 2016
Substrate-free mechanical interconnection of electronic sub-systems using a spring configuration
NUVOTRONICS LLC33 citations91
US9306255B1Apr 5, 2016
Microstructure including microstructural waveguide elements and/or IC chips that are mechanically interconnected to each other
NUVOTRONICS LLC7 citations82