Inventor

MU QIANLI

US29 patents

⚠️ This page may combine multiple inventors who share the name “MU QIANLI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MU QIANLI

WOLFSPEED INC

Output-integrated transistor amplifier device packages incorporating internal connections

Field effect transistor with source-connected field plate

Multi-zone radio frequency transistor amplifiers

Radio frequency transistor amplifiers and other multi-cell transistors having isolation structures

Radio frequency transistor amplifiers having engineered intrinsic capacitances for improved performance

RF amplifiers having shielded transmission line structures

Radio frequency transistor amplifiers having engineered instrinsic capacitances for improved performance

Group III nitride-based radio frequency transistor amplifiers having source, gate and/or drain conductive vias

Compensation of trapping in field effect transistors

Packages with backside mounted die and exposed die interconnects and methods of fabricating the same

Stacked RF circuit topology using transistor die with through silicon carbide vias on gate and/or drain

RF amplifier devices including interconnect structures and methods of manufacturing

CREE INC

Radio frequency transistor amplifiers and other multi-cell transistors having isolation structures

Radio frequency transistor amplifiers and other multi-cell transistors having gaps and/or isolation structures between groups of unit cell transistors

Group III nitride-based radio frequency amplifiers having back side source, gate and/or drain terminals

RF power amplifier with combined baseband, fundamental and harmonic tuning network

Packaging for RF transistor amplifiers

Radio frequency transistor amplifiers and other multi-cell transistors having isolation structures

Radio frequency (RF) transistor amplifier packages with improved isolation and lead configurations

PCB based semiconductor device

PCB based semiconductor package with impedance matching network elements integrated therein

MACOM TECH SOLUTIONS HOLDINGS INC

Stacked RF circuit topology

RF amplifiers having shielded transmission line structures

RF amplifier devices and methods of manufacturing including modularized designs with flip chip interconnections

Group III nitride-based radio frequency transistor amplifiers having source, gate and/or drain conductive vias

Multi-zone radio frequency transistor amplifiers

RF amplifier devices including top side contacts and methods of manufacturing

INFINEON TECHNOLOGIES AG

PCB based semiconductor package having integrated electrical functionality

PCB based semiconductor package with impedance matching network elements integrated therein