Inventor
MITCHELL NATHAN A
US13 patents
⚠️ This page may combine multiple inventors who share the name “MITCHELL NATHAN A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CISCO TECH INC
5 patentsUS7046663B1May 16, 2006
System and method for intercepting packets in a pipeline network processor
CISCO TECH INC34 citations88
US7317724B2Jan 8, 2008
Performing compression of user datagram protocol packets
CISCO TECH INC9 citations83
US7065087B2Jun 20, 2006
Performing compression of user datagram protocol packets
CISCO TECH INC9 citations72
US7675851B2Mar 9, 2010
System and method for synchronizing a back-up device in a communications environment
CISCO TECH INC3 citations61
US7826455B2Nov 2, 2010
Providing single point-of-presence across multiple processors
CISCO TECH INC0 citations41
COMPAQ COMPUTER CORP
3 patentsUS6253836B1Jul 3, 2001
Flexible heat pipe structure and associated methods for dissipating heat in electronic apparatus
COMPAQ COMPUTER CORP41 citations95
US5272327ADec 21, 1993
Constant brightness liquid crystal display backlight control system
COMPAQ COMPUTER CORP58 citations90
US5309132AMay 3, 1994
Technique for trimming photoresistors and trimmed photoresistors
COMPAQ COMPUTER CORP1 citations49
IBM
2 patentsUS5625845AApr 29, 1997
System for facilitating continuous, real-time, unidirectional, and asynchronous intertask and end-device communication in a multimedia data processing system using open architecture data communication modules
IBM113 citations95
US5630132AMay 13, 1997
Method and apparatus for facilitating real-time and asynchronous loading and temporally-overlapping of modular multimedia software tasks in a multimedia data processing system
IBM37 citations88
HEWLETT PACKARD DEVELOPMENT CO
2 patentsUS6595269B2Jul 22, 2003
Flexible heat pipe structure and associated methods for dissipating heat in electronic apparatus
HEWLETT PACKARD DEVELOPMENT CO30 citations92
US6912785B2Jul 5, 2005
Flexible heat pipe structure and associated methods for dissipating heat in electronic apparatus
HEWLETT PACKARD DEVELOPMENT CO12 citations83