Inventor
HUANG CHENG-YEH
TW8 patents
⚠️ This page may combine multiple inventors who share the name “HUANG CHENG-YEH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
UNITED MICROELECTRONICS CORP
4 patentsUS10957762B2Mar 23, 2021
Manufacturing method of semiconductor device including conductive structure
UNITED MICROELECTRONICS CORP0 citations61
US10892365B2Jan 12, 2021
Fin field effect transistor having crystalline titanium germanosilicide stressor layer
UNITED MICROELECTRONICS CORP0 citations61
US10700163B2Jun 30, 2020
Semiconductor device including conductive structure and manufacturing method thereof
UNITED MICROELECTRONICS CORP1 citations61
US10608113B1Mar 31, 2020
Semiconductor structure and fabrication method thereof
UNITED MICROELECTRONICS CORP1 citations61
TAIWAN SEMICONDUCTOR MFG CO LTD
3 patentsUS10734489B2Aug 4, 2020
Method for forming semiconductor device structure with metal silicide layer
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US12183793B2Dec 31, 2024
Method for forming semiconductor device structure with metal-semiconductor compound layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11101354B2Aug 24, 2021
Method for forming semiconductor device structure with metal silicide layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61