Inventor

SON DAEWOO

KR4 patents

⚠️ This page may combine multiple inventors who share the name “SON DAEWOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SON DAEWOO

2 patents

US8836149B2Sep 16, 2014

Hybrid substrates, semiconductor packages including the same and methods for fabricating semiconductor packages

SON DAEWOO14 citations88

US9460937B2Oct 4, 2016

Hybrid substrates, semiconductor packages including the same and methods for fabricating semiconductor packages

SON DAEWOO4 citations69

SAMSUNG ELECTRONICS CO LTD

1 patent

US9620494B2Apr 11, 2017

Hybrid substrates, semiconductor packages including the same and methods for fabricating semiconductor packages

SAMSUNG ELECTRONICS CO LTD3 citations71

CHO YOUNGSANG

1 patent

US8198722B2Jun 12, 2012

Semiconductor package

CHO YOUNGSANG3 citations55