Inventor

WANG LIN-WEI

TW7 patents

⚠️ This page may combine multiple inventors who share the name “WANG LIN-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG

2 patents

US8616433B2Dec 31, 2013

Forming low stress joints using thermal compress bonding

TAIWAN SEMICONDUCTOR MFG2 citations62

US8360303B2Jan 29, 2013

Forming low stress joints using thermal compress bonding

TAIWAN SEMICONDUCTOR MFG1 citations51

HWANG CHIEN LING

2 patents

US8940618B2Jan 27, 2015

Method and device for cutting semiconductor wafers

HWANG CHIEN LING2 citations61

US8834662B2Sep 16, 2014

Apparatus and method of separating wafer from carrier

HWANG CHIEN LING0 citations51

TAIWAN SEMICONDUCTOR MFG CO LTD

1 patent

US9735039B2Aug 15, 2017

Apparatus for separating wafer from carrier

TAIWAN SEMICONDUCTOR MFG CO LTD10 citations83

JANG BOR-PING

1 patent

US9700950B2Jul 11, 2017

Innovative multi-purpose dipping plate

JANG BOR-PING2 citations70

HSIAO YI-LI

1 patent

US8702871B2Apr 22, 2014

Package assembly cleaning process using vaporized solvent

HSIAO YI-LI0 citations51