Inventor

HSIAO YI-LI

TW51 patents

⚠️ This page may combine multiple inventors who share the name “HSIAO YI-LI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HSIAO YI-LI

TAIWAN SEMICONDUCTOR MFG CO LTD

Semiconductor device and bump formation process

Bonding method of package components and bonding apparatus

Methods for stud bump formation

Pick-and-place tool for packaging process

Two-step direct bonding processes and tools for performing the same

Semiconductor device and bump formation process

Methods for forming apparatus for stud bump formation

Bonding with pre-deoxide process and apparatus for performing the same

Method for forming a semiconductor component with a cooling structure

Bonding method of package components and bonding apparatus

Semiconductor component with cooling structure

Semiconductor device and bump formation process

Bonding with pre-deoxide process and apparatus for performing the same

Solder bump stretching method

Metal post bonding using pre-fabricated metal posts

Thinning process using metal-assisted chemical etching

Solder bump stretching method and device for performing the same

Indirect printing bumping method for solder ball deposition

Semiconductor device and bump formation process

Solder bump stretching method for forming a solder bump joint in a device

Solder bump joint in a device including lamellar structures

Immersion interconnections for semiconductor devices and methods of manufacture thereof

TAIWAN SEMICONDUCTOR MFG

Method and apparatus for detecting proper orientation of a semiconductor wafer in a wafer transfer system

Method for detecting wafer orientation during transport

Adjustable electrodes and coils for plasma density distribution control

PVD target with end of service life detection capability

Jigs with controlled spacing for bonding dies onto package substrates

Substrate carrier, port apparatus and facility interface and apparatus including same

Apparatus for clamping and transporting a semiconductor wafer

Semiconductor device with copper-tin compound on copper connector

Pick-and-place tool for packaging process

Substrate carrier and facility interface and apparatus including same

Substrate carrier and facility interface and apparatus including same

Stacked package and method of manufacturing the same

Method and system for yield and productivity improvements in semiconductor processing

Method for manufacturing a plurality of metal posts

Method and system for manufacturing semiconductor device

Methods for forming apparatus for stud bump formation

HSIAO YI-LI

Wafer&#39;s ambiance control

Apparatus for storing substrates

Package assembly cleaning process using vaporized solvent

In-situ accuracy control in flux dipping

PVD target with end of service life detection capability

Adjustable anode assembly for a substrate wet processing apparatus

HWANG CHIEN LING

Pick-and-place tool for packaging process

Apparatus for stud bump formation

Method for reducing voids in a copper-tin interface and structure formed thereby

LIN YEONG-JYH

Methods for stud bump formation and apparatus for performing the same

JANG BOR-PING

Innovative multi-purpose dipping plate

YU CHEN-HUA

Cluster processing apparatus for metallization processing in semiconductor manufacturing

Wafer's ambiance control