Inventor
METZ MATTHEW V
US244 patents
⚠️ This page may combine multiple inventors who share the name “METZ MATTHEW V”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
42 patentsUS7126199B2Oct 24, 2006
Multilayer metal gate electrode
INTEL CORP154 citations99
US7569443B2Aug 4, 2009
Complementary metal oxide semiconductor integrated circuit using raised source drain and replacement metal gate
INTEL CORP72 citations98
US7485503B2Feb 3, 2009
Dielectric interface for group III-V semiconductor device
INTEL CORP63 citations98
US7479421B2Jan 20, 2009
Process for integrating planar and non-planar CMOS transistors on a bulk substrate and article made thereby
INTEL CORP105 citations98
US7390709B2Jun 24, 2008
Method for making a semiconductor device having a high-k gate dielectric layer and a metal gate electrode
INTEL CORP71 citations98
US7381608B2Jun 3, 2008
Method for making a semiconductor device with a high-k gate dielectric and a metal gate electrode
INTEL CORP85 citations98
US7226831B1Jun 5, 2007
Device with scavenging spacer layer
INTEL CORP60 citations98
US7220635B2May 22, 2007
Method for making a semiconductor device with a metal gate electrode that is formed on an annealed high-k gate dielectric layer
INTEL CORP78 citations98
US7217611B2May 15, 2007
Methods for integrating replacement metal gate structures
INTEL CORP70 citations98
US7208361B2Apr 24, 2007
Replacement gate process for making a semiconductor device that includes a metal gate electrode
INTEL CORP128 citations98
US7157378B2Jan 2, 2007
Method for making a semiconductor device having a high-k gate dielectric layer and a metal gate electrode
INTEL CORP107 citations98
US7153734B2Dec 26, 2006
CMOS device with metal and silicide gate electrodes and a method for making it
INTEL CORP64 citations98
US7153784B2Dec 26, 2006
Method for making a semiconductor device having a high-k gate dielectric layer and a metal gate electrode
INTEL CORP86 citations98
US7148548B2Dec 12, 2006
Semiconductor device with a high-k gate dielectric and a metal gate electrode
INTEL CORP117 citations98
US7064066B1Jun 20, 2006
Method for making a semiconductor device having a high-k gate dielectric and a titanium carbide gate electrode
INTEL CORP65 citations98
US7727830B2Jun 1, 2010
Fabrication of germanium nanowire transistors
INTEL CORP58 citations97
US7074680B2Jul 11, 2006
Method for making a semiconductor device having a high-k gate dielectric
INTEL CORP64 citations97
US7858481B2Dec 28, 2010
Method for fabricating transistor with thinned channel
INTEL CORP28 citations96
US7355281B2Apr 8, 2008
Method for making semiconductor device having a high-k gate dielectric layer and a metal gate electrode
INTEL CORP47 citations96
US7323423B2Jan 29, 2008
Forming high-k dielectric layers on smooth substrates
INTEL CORP49 citations96
US7176090B2Feb 13, 2007
Method for making a semiconductor device that includes a metal gate electrode
INTEL CORP58 citations96
US7138323B2Nov 21, 2006
Planarizing a semiconductor structure to form replacement metal gates
INTEL CORP51 citations96
US7060568B2Jun 13, 2006
Using different gate dielectrics with NMOS and PMOS transistors of a complementary metal oxide semiconductor integrated circuit
INTEL CORP53 citations96
US6716707B1Apr 6, 2004
Method for making a semiconductor device having a high-k gate dielectric
INTEL CORP52 citations96
US6713358B1Mar 30, 2004
Method for making a semiconductor device having a high-k gate dielectric
INTEL CORP77 citations95
US7989280B2Aug 2, 2011
Dielectric interface for group III-V semiconductor device
INTEL CORP20 citations93
US7902058B2Mar 8, 2011
Inducing strain in the channels of metal gate transistors
INTEL CORP30 citations93
US7718479B2May 18, 2010
Forming integrated circuits with replacement metal gate electrodes
INTEL CORP15 citations93
US7704833B2Apr 27, 2010
Method of forming abrupt source drain metal gate transistors
INTEL CORP22 citations93
US7670894B2Mar 2, 2010
Selective high-k dielectric film deposition for semiconductor device
INTEL CORP20 citations93
US7425500B2Sep 16, 2008
Uniform silicide metal on epitaxially grown source and drain regions of three-dimensional transistors
INTEL CORP45 citations93
US7384880B2Jun 10, 2008
Method for making a semiconductor device having a high-k gate dielectric
INTEL CORP29 citations93
US7317231B2Jan 8, 2008
Method for making a semiconductor device having a high-K gate dielectric and a titanium carbide gate electrode
INTEL CORP35 citations93
US7160767B2Jan 9, 2007
Method for making a semiconductor device that includes a metal gate electrode
INTEL CORP54 citations93
US7148099B2Dec 12, 2006
Reducing the dielectric constant of a portion of a gate dielectric
INTEL CORP20 citations93
US6939815B2Sep 6, 2005
Method for making a semiconductor device having a high-k gate dielectric
INTEL CORP20 citations93
US6893927B1May 17, 2005
Method for making a semiconductor device with a metal gate electrode
INTEL CORP38 citations93
US6887800B1May 3, 2005
Method for making a semiconductor device with a high-k gate dielectric and metal layers that meet at a P/N junction
INTEL CORP23 citations93
US7785958B2Aug 31, 2010
Method for making a semiconductor device having a high-k gate dielectric layer and a metal gate electrode
INTEL CORP38 citations92
US7595248B2Sep 29, 2009
Angled implantation for removal of thin film layers
INTEL CORP28 citations92
US7439113B2Oct 21, 2008
Forming dual metal complementary metal oxide semiconductor integrated circuits
INTEL CORP23 citations92
US7129182B2Oct 31, 2006
Method for etching a thin metal layer
INTEL CORP19 citations92
PILLARISETTY RAVI
3 patentsUS8765563B2Jul 1, 2014
Trench confined epitaxially grown device layer(s)
PILLARISETTY RAVI42 citations98
US9634007B2Apr 25, 2017
Trench confined epitaxially grown device layer(s)
PILLARISETTY RAVI16 citations93
US9123790B2Sep 1, 2015
Contact techniques and configurations for reducing parasitic resistance in nanowire transistors
PILLARISETTY RAVI24 citations93
MUKHERJEE NILOY
2 patentsUS8110877B2Feb 7, 2012
Metal-insulator-semiconductor tunneling contacts having an insulative layer disposed between source/drain contacts and source/drain regions
MUKHERJEE NILOY108 citations99
US8952541B2Feb 10, 2015
Method of fabricating metal-insulator-semiconductor tunneling contacts using conformal deposition and thermal growth processes
MUKHERJEE NILOY36 citations94
JIN BEEN-YIH
1 patentKAVALIEROS JACK T
1 patentDATTA SUMAN
1 patentShowing the top 50 of 244 patents by PatentIndex Score.