Inventor
CHAU ROBERT S
US419 patents
⚠️ This page may combine multiple inventors who share the name “CHAU ROBERT S”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
45 patentsUS7531437B2May 12, 2009
Method of forming metal gate electrodes using sacrificial gate electrode material and sacrificial gate dielectric material
INTEL CORP195 citations99
US7518196B2Apr 14, 2009
Field effect transistor with narrow bandgap source and drain regions and method of fabrication
INTEL CORP72 citations99
US7485536B2Feb 3, 2009
Abrupt junction formation by atomic layer epitaxy of in situ delta doped dopant diffusion barriers
INTEL CORP155 citations99
US7358121B2Apr 15, 2008
Tri-gate devices and methods of fabrication
INTEL CORP153 citations99
US7241653B2Jul 10, 2007
Nonplanar device with stress incorporation layer and method of fabrication
INTEL CORP125 citations99
US7170120B2Jan 30, 2007
Carbon nanotube energy well (CNEW) field effect transistor
INTEL CORP149 citations99
US7126199B2Oct 24, 2006
Multilayer metal gate electrode
INTEL CORP154 citations99
US7105390B2Sep 12, 2006
Nonplanar transistors with metal gate electrodes
INTEL CORP416 citations99
US7022559B2Apr 4, 2006
MOSFET gate electrodes having performance tuned work functions and methods of making same
INTEL CORP216 citations99
US7005366B2Feb 28, 2006
Tri-gate devices and methods of fabrication
INTEL CORP121 citations99
US6974738B2Dec 13, 2005
Nonplanar device with stress incorporation layer and method of fabrication
INTEL CORP97 citations99
US6914295B2Jul 5, 2005
Tri-gate devices and methods of fabrication
INTEL CORP71 citations99
US6909151B2Jun 21, 2005
Nonplanar device with stress incorporation layer and method of fabrication
INTEL CORP241 citations99
US6887762B1May 3, 2005
Method of fabricating a field effect transistor structure with abrupt source/drain junctions
INTEL CORP141 citations99
US6885084B2Apr 26, 2005
Semiconductor transistor having a stressed channel
INTEL CORP159 citations99
US6861318B2Mar 1, 2005
Semiconductor transistor having a stressed channel
INTEL CORP165 citations99
US6858478B2Feb 22, 2005
Tri-gate devices and methods of fabrication
INTEL CORP629 citations99
US6797556B2Sep 28, 2004
MOS transistor structure and method of fabrication
INTEL CORP139 citations99
US6653700B2Nov 25, 2003
Transistor structure and method of fabrication
INTEL CORP144 citations99
US6621131B2Sep 16, 2003
Semiconductor transistor having a stressed channel
INTEL CORP534 citations99
US6214679B1Apr 10, 2001
Cobalt salicidation method on a silicon germanium film
INTEL CORP218 citations99
US6165826ADec 26, 2000
Transistor with low resistance tip and method of fabrication in a CMOS process
INTEL CORP301 citations99
US5783478AJul 21, 1998
Method of frabricating a MOS transistor having a composite gate electrode
INTEL CORP157 citations99
US5780346AJul 14, 1998
N2 O nitrided-oxide trench sidewalls and method of making isolation structure
INTEL CORP141 citations99
US5763922AJun 9, 1998
CMOS integrated circuit having PMOS and NMOS devices with different gate dielectric layers
INTEL CORP224 citations99
US5625217AApr 29, 1997
MOS transistor having a composite gate electrode and method of fabrication
INTEL CORP162 citations99
US7898041B2Mar 1, 2011
Block contact architectures for nanoscale channel transistors
INTEL CORP113 citations98
US7569443B2Aug 4, 2009
Complementary metal oxide semiconductor integrated circuit using raised source drain and replacement metal gate
INTEL CORP72 citations98
US7547637B2Jun 16, 2009
Methods for patterning a semiconductor film
INTEL CORP52 citations98
US7525160B2Apr 28, 2009
Multigate device with recessed strain regions
INTEL CORP65 citations98
US7485503B2Feb 3, 2009
Dielectric interface for group III-V semiconductor device
INTEL CORP63 citations98
US7479421B2Jan 20, 2009
Process for integrating planar and non-planar CMOS transistors on a bulk substrate and article made thereby
INTEL CORP105 citations98
US7456476B2Nov 25, 2008
Nonplanar semiconductor device with partially or fully wrapped around gate electrode and methods of fabrication
INTEL CORP222 citations98
US7407847B2Aug 5, 2008
Stacked multi-gate transistor design and method of fabrication
INTEL CORP99 citations98
US7390709B2Jun 24, 2008
Method for making a semiconductor device having a high-k gate dielectric layer and a metal gate electrode
INTEL CORP71 citations98
US7381608B2Jun 3, 2008
Method for making a semiconductor device with a high-k gate dielectric and a metal gate electrode
INTEL CORP85 citations98
US7361958B2Apr 22, 2008
Nonplanar transistors with metal gate electrodes
INTEL CORP86 citations98
US7329913B2Feb 12, 2008
Nonplanar transistors with metal gate electrodes
INTEL CORP114 citations98
US7326656B2Feb 5, 2008
Method of forming a metal oxide dielectric
INTEL CORP456 citations98
US7279375B2Oct 9, 2007
Block contact architectures for nanoscale channel transistors
INTEL CORP93 citations98
US7226831B1Jun 5, 2007
Device with scavenging spacer layer
INTEL CORP60 citations98
US7220635B2May 22, 2007
Method for making a semiconductor device with a metal gate electrode that is formed on an annealed high-k gate dielectric layer
INTEL CORP78 citations98
US7217611B2May 15, 2007
Methods for integrating replacement metal gate structures
INTEL CORP70 citations98
US7208361B2Apr 24, 2007
Replacement gate process for making a semiconductor device that includes a metal gate electrode
INTEL CORP128 citations98
US7157378B2Jan 2, 2007
Method for making a semiconductor device having a high-k gate dielectric layer and a metal gate electrode
INTEL CORP107 citations98
PILLARISETTY RAVI
2 patentsMUKHERJEE NILOY
1 patentRACHMADY WILLY
1 patentDEWEY GILBERT
1 patentShowing the top 50 of 419 patents by PatentIndex Score.