Inventor
ONG T P
US7 patents
Patents
7 patentsUS5918147AJun 29, 1999
Process for forming a semiconductor device with an antireflective layer
MOTOROLA INC89 citations95
US5880041AMar 9, 1999
Method for forming a dielectric layer using high pressure
MOTOROLA INC67 citations94
US5801098ASep 1, 1998
Method of decreasing resistivity in an electrically conductive layer
MOTOROLA INC103 citations93
US6686633B1Feb 3, 2004
Semiconductor device, memory cell, and processes for forming them
MOTOROLA INC16 citations91
US6184073B1Feb 6, 2001
Process for forming a semiconductor device having an interconnect or conductive film electrically insulated from a conductive member or region
MOTOROLA INC27 citations91
US6077768AJun 20, 2000
Process for fabricating a multilevel interconnect
MOTOROLA INC24 citations91
US5783485AJul 21, 1998
Process for fabricating a metallized interconnect
MOTOROLA INC27 citations91