Inventor
TSUYOSHI HIROAKI
JP4 patents
Patents
4 patentsUS5800722ASep 1, 1998
Multilayer printed wiring board and process for manufacturing the same
MITSUI MINING & SMELTING CO13 citations71
US6165617ADec 26, 2000
Resin-coated copper foil for multilayer printed wiring board and multilayer printed wiring board provided with said copper foil
MITSUI MINING & SMELTING CO13 citations69
US10280501B2May 7, 2019
Roughened copper foil, copper clad laminate, and printed circuit board
MITSUI MINING & SMELTING CO0 citations49
US9338898B2May 10, 2016
Method of producing a printed wiring board
MITSUI MINING & SMELTING CO0 citations45