Inventor

JO AHYUN

KR2 patents

Patents

2 patents

US9735121B2Aug 15, 2017

Semiconductor chip, semiconductor package including the same, and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD2 citations65

US10090266B2Oct 2, 2018

Semiconductor device, and method of fabricating the same

SAMSUNG ELECTRONICS CO LTD2 citations62