Inventor
BANG YOONCHEOL
KR2 patents
Patents
2 patentsUS9911688B2Mar 6, 2018
Semiconductor chip, semiconductor package including the same, and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations67
US9735121B2Aug 15, 2017
Semiconductor chip, semiconductor package including the same, and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD2 citations65