Inventor
LAMOREY MARK C
US21 patents
⚠️ This page may combine multiple inventors who share the name “LAMOREY MARK C”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
16 patentsUS9209141B2Dec 8, 2015
Shielded package assemblies with integrated capacitor
IBM13 citations92
US9059127B1Jun 16, 2015
Packages for three-dimensional die stacks
IBM15 citations92
US11049819B2Jun 29, 2021
Shielded package assemblies with integrated capacitor
IBM4 citations84
US9935058B2Apr 3, 2018
Shielded package assemblies with integrated capacitor
IBM4 citations84
US9531209B2Dec 27, 2016
Shielded package assemblies with integrated capacitor
IBM4 citations84
US9252101B2Feb 2, 2016
Packages for three-dimensional die stacks
IBM9 citations84
US9190399B2Nov 17, 2015
Thermally enhanced three-dimensional integrated circuit package
IBM16 citations84
US9253822B2Feb 2, 2016
Phase change material variable capacitor
IBM9 citations83
US10553544B2Feb 4, 2020
Shielded package assemblies with integrated capacitor
IBM2 citations73
US9613915B2Apr 4, 2017
Reduced-warpage laminate structure
IBM2 citations73
US9543255B2Jan 10, 2017
Reduced-warpage laminate structure
IBM3 citations73
US9018040B2Apr 28, 2015
Power distribution for 3D semiconductor package
IBM5 citations73
US9078373B1Jul 7, 2015
Integrated circuit structures having off-axis in-hole capacitor and methods of forming
IBM2 citations63
US7660152B2Feb 9, 2010
Method and apparatus for implementing self-referencing read operation for PCRAM devices
IBM5 citations62
US10685919B2Jun 16, 2020
Reduced-warpage laminate structure
IBM0 citations52
US9185807B2Nov 10, 2015
Integrated circuit structures having off-axis in-hole capacitor
IBM0 citations52