Inventor
PATEL JANAK G
US36 patents
⚠️ This page may combine multiple inventors who share the name “PATEL JANAK G”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
27 patentsUS6167524ADec 26, 2000
Apparatus and method for efficient battery utilization in portable personal computers
IBM123 citations98
US6163073ADec 19, 2000
Integrated heatsink and heatpipe
IBM109 citations98
US9209141B2Dec 8, 2015
Shielded package assemblies with integrated capacitor
IBM13 citations92
US9059127B1Jun 16, 2015
Packages for three-dimensional die stacks
IBM15 citations92
US6850411B1Feb 1, 2005
Method and structure to support heat sink arrangement on chip carrier packages
IBM26 citations92
US6341062B1Jan 22, 2002
Thermal transfer hinge for hinged mobile computing device and method of heat transfer
IBM50 citations92
US6246583B1Jun 12, 2001
Method and apparatus for removing heat from a semiconductor device
IBM39 citations92
US6665194B1Dec 16, 2003
Chip package having connectors on at least two sides
IBM28 citations90
US11049819B2Jun 29, 2021
Shielded package assemblies with integrated capacitor
IBM4 citations84
US9935058B2Apr 3, 2018
Shielded package assemblies with integrated capacitor
IBM4 citations84
US9531209B2Dec 27, 2016
Shielded package assemblies with integrated capacitor
IBM4 citations84
US9252101B2Feb 2, 2016
Packages for three-dimensional die stacks
IBM9 citations84
US9190399B2Nov 17, 2015
Thermally enhanced three-dimensional integrated circuit package
IBM16 citations84
US6816374B2Nov 9, 2004
High efficiency heat sink/air cooler system for heat-generating components
IBM9 citations74
US10553544B2Feb 4, 2020
Shielded package assemblies with integrated capacitor
IBM2 citations73
US9613915B2Apr 4, 2017
Reduced-warpage laminate structure
IBM2 citations73
US9543255B2Jan 10, 2017
Reduced-warpage laminate structure
IBM3 citations73
US9018040B2Apr 28, 2015
Power distribution for 3D semiconductor package
IBM5 citations73
US10342160B2Jul 2, 2019
Heat sink attachment on existing heat sinks
IBM2 citations72
US9883612B2Jan 30, 2018
Heat sink attachment on existing heat sinks
IBM5 citations72
US8952503B2Feb 10, 2015
Organic module EMI shielding structures and methods
IBM4 citations72
US9078373B1Jul 7, 2015
Integrated circuit structures having off-axis in-hole capacitor and methods of forming
IBM2 citations63
US10685919B2Jun 16, 2020
Reduced-warpage laminate structure
IBM0 citations52
US9185807B2Nov 10, 2015
Integrated circuit structures having off-axis in-hole capacitor
IBM0 citations52
US9245854B2Jan 26, 2016
Organic module EMI shielding structures and methods
IBM1 citations51
US8999846B2Apr 7, 2015
Elongated via structures
IBM0 citations51
US9599664B2Mar 21, 2017
Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structures
IBM1 citations50
LACROIX LUKE D
4 patentsUS8653662B2Feb 18, 2014
Structure for monitoring stress induced failures in interlevel dielectric layers of solder bump integrated circuits
LACROIX LUKE D5 citations71
US8759977B2Jun 24, 2014
Elongated via structures
LACROIX LUKE D3 citations60
US8586982B2Nov 19, 2013
Semiconductor test chip device to mimic field thermal mini-cycles to assess reliability
LACROIX LUKE D1 citations50
US9057760B2Jun 16, 2015
Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structures
LACROIX LUKE D1 citations48
MARVELL ASIA PTE LTD
2 patentsUS11682646B2Jun 20, 2023
IC chip package with dummy solder structure under corner, and related method
MARVELL ASIA PTE LTD1 citations61
US12588470B2Mar 24, 2026
Methods for assembling stacked substrate packages including dies, laminated base substrates, and dielectric build-up substrates
MARVELL ASIA PTE LTD0 citations50