Inventor

STONE DAVID B

US55 patents

⚠️ This page may combine multiple inventors who share the name “STONE DAVID B”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

STONE DAVID B

IBM

Passive interposer including at least one passive electronic component

Electronic package with high density interconnect layer

Electronic package for electronic components and method of making same

Shielded package assemblies with integrated capacitor

Packages for three-dimensional die stacks

Method of making a multi-layered interconnect structure

Radial contact pad footprint and wiring for electrical components

High density design for organic chip carriers

Resistivity control of CIC material

Packaging reliability superchips

Shielded package assemblies with integrated capacitor

Shielded package assemblies with integrated capacitor

Shielded package assemblies with integrated capacitor

Packages for three-dimensional die stacks

Thermally enhanced three-dimensional integrated circuit package

LCD cover optical structure and method

Tented plated through-holes and method for fabrication thereof

Tented plated through-holes and method for fabrication thereof

Shielded package assemblies with integrated capacitor

Reduced-warpage laminate structure

Reduced-warpage laminate structure

Power distribution for 3D semiconductor package

Method of making an electronic package

Organic module EMI shielding structures and methods

Vents with signal image for signal return path

Split ball grid array pad for multi-chip modules

Fabrication tool and method for parallel processor structure and package

Integrated circuit structures having off-axis in-hole capacitor and methods of forming

Display panel having individual display devices bonded to light transmitting plates which have a combined area greater than of the devices

Vents with signal image for signal return path

Packaging reliability super chips

Flexible strip structure for a parallel processor and method of fabricating the flexible strip

Reduced-warpage laminate structure

Integrated circuit structures having off-axis in-hole capacitor

Organic module EMI shielding structures and methods

Semiconductor test and monitoring structure to detect boundaries of safe effective modulus

Elongated via structures

Circuit for detecting structural defects in an integrated circuit chip, methods of use and manufacture and design structures

Split ball grid array pad for multi-chip modules

Electrical property altering, planar member with solder element in IC chip package

LACROIX LUKE D

Structure for monitoring stress induced failures in interlevel dielectric layers of solder bump integrated circuits

Elongated via structures

Semiconductor test chip device to mimic field thermal mini-cycles to assess reliability

GLOBALFOUNDRIES INC

Interconnected integrated circuit (IC) chip structure and packaging and method of forming same

Chamfered corner crackstop for an integrated circuit chip

(unassigned)

Soccer training system

LAMOREY MARK C H

Method, structures and method of designing reduced delamination integrated circuits

CRAIN JR JAMES V

Semiconductor test and monitoring structure to detect boundaries of safe effective modulus

BONILLA GRISELDA

Optimization metallization for prevention of dielectric cracking under controlled collapse chip connections

COLGAN EVAN G

Packaging identical chips in a stacked structure