Inventor
SIROCKA NATHAN J
US4 patents
Patents
4 patentsUS11107795B2Aug 31, 2021
Semiconductor devices with duplicated die bond pads and associated device packages and methods of manufacture
MICRON TECHNOLOGY INC2 citations69
US10388630B2Aug 20, 2019
Semiconductor devices with duplicated die bond pads and associated device packages and methods of manufacture
MICRON TECHNOLOGY INC1 citations69
US9875993B2Jan 23, 2018
Semiconductor devices with duplicated die bond pads and associated device packages and methods of manufacture
MICRON TECHNOLOGY INC2 citations69
US11594522B2Feb 28, 2023
Semiconductor devices with duplicated die bond pads and associated device packages and methods of manufacture
MICRON TECHNOLOGY INC0 citations59